• Medientyp: E-Book; Hochschulschrift
  • Titel: Komplexe Polykondensation von Ethylenglykol in einem RF-Niederdruckplasma zur Bildung funktioneller Schichten
  • Beteiligte: Schäfer, Jan [VerfasserIn]
  • Erschienen: 2006
  • Umfang: Online-Ressource (PDF-Datei: 107 S., 10862 KB)
  • Sprache: Deutsch
  • Identifikator:
  • Schlagwörter: Ethylenglykol > Polykondensation > PECVD-Verfahren > Hochfrequenzplasma > Niederdruckplasma
  • Entstehung:
  • Hochschulschrift: Greifswald, Univ., Diss., 2007
  • Anmerkungen: Systemvoraussetzungen: Acrobat reader
  • Beschreibung: Hochfrequenzplasma, PECVD-Verfahren, FT-IR-Spektroskopie, Ethylenglykol, Polyethylenglykole

    The present work is focused on the plasma chemical deposition and physicochemical characterization of thin organic layer based on ethylene glycol (EG, precursor). The coating can minimize an adsorption of proteins on the surface. Herewith it can be proved as a new suitable biocompatible material. The main part of the work is concentrated on the development of an RF plasma reactor (called Nevada) and on an innovative deposition technology TFPD (Temperature Forced Plasma Deposition) extending the conventional PECVD (Plasma Enhanced Chemical Vapour Deposition). A mixture of ethylene glycol and argon has been studied as a model system. The plasma conditions and the surface temperature have been optimized according to the thermodynamic properties of ethylene glycol. The complex polycondensation represents a plasma enhanced conversion of the condensed film of EG into a stable poly(ethylene glycol)-like plasma polymer. The process has been monitored by means of the simultaneous surface temperature control and in situ FTIR spectroscopy of the film. The diagnostics XPS, AFM, TDS, MALDI, XRD and optical ellipsometry have been applied in order to characterize the samples and their creation. Using the new method TFPD, the samples have been made, their surfaces are characterized by an excellent surface roughness, water insolubility and application potential for biocompatibility.
  • Zugangsstatus: Freier Zugang