• Medientyp: E-Book; Konferenzbericht
  • Titel: 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) : 24 -27 Oct. 2013, Galaţi, Romania
  • Weitere Titel: Nebent.: Conference proceedings // 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
  • Körperschaft: Institute of Electrical and Electronics Engineers
  • Erschienen: Piscataway, NJ: IEEE, 2013
  • Umfang: Online-Ressource
  • Sprache: Englisch
  • ISBN: 9781479915545; 1479915556; 9781479915552
  • Schlagwörter: Electronic packaging Congresses ; Konferenzschrift
  • Entstehung:
  • Anmerkungen: Gaps in pagination due to withheld papers. - Co-located with the first AFCEA (Armed Forces Communications and Electronics Association) Romanian Studen Club meeting