> Detailanzeige

Akin, Meriem [VerfasserIn]; Rezem, Maher [VerfasserIn]; Rahlves, Maik [VerfasserIn]; Cromwell, Kevin [VerfasserIn]; Roth, Bernhard [VerfasserIn]; Reithmeier, Eduard [VerfasserIn]; Wurz, Marc Christopher [VerfasserIn]; Rissing, Lutz [VerfasserIn]; Maier, Hans Jürgen [VerfasserIn]

Direct hot embossing of microelements by means of photostructurable polyimide - [published Version]

Literatur-
verwaltung

Zur
Merkliste

Lösche von
Merkliste

Per Whatsapp teilen

Schließen

Merkliste



Sie können Bookmarks mittels Listen verwalten, loggen Sie sich dafür bitte in Ihr SLUB Benutzerkonto ein.
  • Medientyp: Sonstige Veröffentlichung; E-Artikel
  • Titel: Direct hot embossing of microelements by means of photostructurable polyimide
  • Beteiligte: Akin, Meriem [VerfasserIn]; Rezem, Maher [VerfasserIn]; Rahlves, Maik [VerfasserIn]; Cromwell, Kevin [VerfasserIn]; Roth, Bernhard [VerfasserIn]; Reithmeier, Eduard [VerfasserIn]; Wurz, Marc Christopher [VerfasserIn]; Rissing, Lutz [VerfasserIn]; Maier, Hans Jürgen [VerfasserIn]
  • Erschienen: Bellingham, WA : S P I E - International Society for Optical Engineering, 2016
  • Erschienen in: Journal of Micro/ Nanolithography, MEMS, and MOEMS 15 (2016), Nr. 3
  • Ausgabe: published Version
  • Sprache: Englisch
  • DOI: https://doi.org/10.15488/1755; https://doi.org/10.1117/1.JMM.15.3.034506
  • ISSN: 1932-5150
  • Schlagwörter: optical devices ; Electroplating ; Light sensitive materials ; Polyimides ; Microstructural patterns ; hot embossing ; Photoresist patterns ; Small-scale production ; Silicones ; stamp reliability ; stamp fabrication ; polyimide ; Polymeric devices ; Photoresists ; fluidic systems ; Hot-embossing ; Molding techniques ; Photo-sensitive polyimide
  • Entstehung:
  • Anmerkungen: Diese Datenquelle enthält auch Bestandsnachweise, die nicht zu einem Volltext führen.
  • Beschreibung: While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns. © 2016 Society of Photo-Optical Instrumentation Engineers (SPIE). ; DFG/CRC/Planar Optronic Systems
  • Zugangsstatus: Freier Zugang