Beschreibung:
<jats:title>Abstract</jats:title>
<jats:p>Thermal bonding of silicon and low-temperature cofired ceramics (LTCC) at sintering temperatures of 900<jats:bold> °</jats:bold>C represents currently the standard process in silicon-ceramic composite (SiCer) substrate fabrication. We analyse the thermal behavior of the LTCC using thermogravimetric analysis, differential scanning calorimetry and laser flash analysis. The thermal decomposition could be identified with a mass loss of 24% in the temperature range up to 1000<jats:bold> °</jats:bold>C what influences the thermal diffusivity with values from about 0.19 mm<jats:sup>2</jats:sup> s<jats:sup>−1</jats:sup> before thermal treatment to below 0.10 mm<jats:sup>2</jats:sup> s<jats:sup>−1</jats:sup> after thermal treatment. A specific heat capacity of 1<jats:bold>–</jats:bold>2 J (g · K)<jats:sup>−1</jats:sup> is calculated. Further, an influence of low-temperature lamination of the LTCC seems to have an influence on the thermal behaviour. The sintering process was investigated with temperatures of 550<jats:bold> °</jats:bold>C, 730<jats:bold> °</jats:bold>C and 900<jats:bold> °</jats:bold>C, applied pressures of 12.2 kPa and 6.1 kPa and intermediate wetting layers of TiO<jats:sub>2</jats:sub> (normal deposition and oblique angle deposition). Optical observations, ultrasonic and scanning electron microscopy, and pull-tests are used to compare the properties of the sintered SiCer substrates. Whereas the sintering temperature has an obvious impact on the sintering behaviour of the LTCC, a direct conclusion of parameter variation on the bonding result was not observed.</jats:p>