Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

Medientyp: E-Artikel
Titel: Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration
Beteiligte: Fukushima, Takafumi; Alam, Arsalan; Hanna, Amir; Jangam, Siva Chandra; Bajwa, Adeel Ahmad; Iyer, Subramanian S.
Erschienen: Institute of Electrical and Electronics Engineers (IEEE), 2018
Erschienen in: IEEE Transactions on Components, Packaging and Manufacturing Technology, 8 (2018) 10, Seite 1738-1746
Sprache: Nicht zu entscheiden
DOI: 10.1109/tcpmt.2018.2871603
ISSN: 2156-3950; 2156-3985
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