• Medientyp: E-Artikel
  • Titel: Performance Simulation of the SCTP under the Multi Path Environment
  • Beteiligte: Fan, Ya Qin; Liu, Shu Ting; Li, Chi
  • Erschienen: Trans Tech Publications, Ltd., 2015
  • Erschienen in: Applied Mechanics and Materials, 738-739 (2015), Seite 1174-1177
  • Sprache: Nicht zu entscheiden
  • DOI: 10.4028/www.scientific.net/amm.738-739.1174
  • ISSN: 1662-7482
  • Schlagwörter: General Engineering
  • Entstehung:
  • Anmerkungen:
  • Beschreibung: This paper studies the basic features and functions of STCP. The traditional TCP protocol and the basic standard SCTP protocols are simulated respectively. We analysis that when the host has multiple network addresses and there are multiple paths between ends, how do the STCP protocol and TCP protocol perform. For practical implementation, using CWND size parameters show performance of multi path transmission in practice, and compare with the ideal case. The results of the simulation and analysis of multi path transmission under the SCTP agreement have practical significance in the future network with multi path transmission.