• Medientyp: E-Artikel
  • Titel: Basal Plane Dislocation Conversion Enhancement in 4H-SiC Homo-Epitaxial Layers by Ion Implantation into the Wafer
  • Beteiligte: Heidorn, Christian; Esteve, Romain; Höchbauer, Tobias; Krieger, Michael; Weber, Heiko B.; Rupp, Roland
  • Erschienen: Trans Tech Publications, Ltd., 2019
  • Erschienen in: Materials Science Forum, 963 (2019), Seite 114-118
  • Sprache: Nicht zu entscheiden
  • DOI: 10.4028/www.scientific.net/msf.963.114
  • ISSN: 1662-9752
  • Schlagwörter: Mechanical Engineering ; Mechanics of Materials ; Condensed Matter Physics ; General Materials Science
  • Entstehung:
  • Anmerkungen:
  • Beschreibung: <jats:p>We studied the impact of ion implantation into the wafer substrate prior to the epitaxy process on the basal plane dislocation conversion behavior during epitaxial layer growth. Defect density measurements show an enhancing effect of the ion implantation on the basal plane dislocation to threading edge dislocation conversion. Analysis of the lateral conversion distribution, the stress field in the material as well as the wafer topography at the onset of epitaxial growth lead us to believe, that stresses in the epitaxy layer cause the enhanced basal plane dislocation conversion.</jats:p>