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  1. Chen, William T. [HerausgeberIn] ; American Society of Mechanical Engineers, American Society of Mechanical Engineers Applied Mechanics Division, International Mechanical Engineering Congress and Exposition 1997 Dallas, Tex, Symposium on Application of Fracture Mechanics in Electronic Packaging 1997 Dallas, Tex

    Application of fracture mechanics in electronic packaging : [contains 23 technical papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging] ; presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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    New York, NY: American Soc. of Mechanical Engineers, 1997

    Erschienen in: American Society of Mechanical Engineers: AMD / American Society of Mechanical Engineers, Applied Mechanics Division ; 22200 - EEP ; 2000