Application of fracture mechanics in electronic packaging: [contains 23 technical papers that were p… - SLUB Dresden

Medientyp: Buch; Konferenzbericht
Titel: Application of fracture mechanics in electronic packaging : [contains 23 technical papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging] ; presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
Beteiligte: Chen, William T. [Hrsg.]
Körperschaft: American Society of Mechanical Engineers ; American Society of Mechanical Engineers, Applied Mechanics Division
Veranstaltung: International Mechanical Engineering Congress and Exposition Symposium on Application of Fracture Mechanics in Electronic Packaging
Erschienen: New York, NY: American Soc. of Mechanical Engineers, 1997
Erschienen in: American Society of Mechanical Engineers: AMD / American Society of Mechanical Engineers, Applied Mechanics Division ; 22200
EEP ; 2000
Umfang: VI, 193 S; Ill., graph. Darst
Sprache: Englisch
ISBN: 0791818276
RVK-Notation: ZN 1900 : Kongressberichte
Schlagwörter: Konferenzschrift
Entstehung:
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0 : AMD

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