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Palavesam, Nagarajan [Author] ; Technische Universität Dresden

Reliability analysis of foil substrate based integration of silicon chips

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Dresden, 26.10.2020
Berndt, Hartmut [Author]

ESD-Schutz : Normen, Konzepte und Messtechnik in der Praxis - [3., überarbeitete und erweiterte Auflage]

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Tübingen: expert, [2019]

Published in: Kontakt & Studium ; 67500
Knebel, Steve [Author] ; Technische Universität Dresden, Logos Verlag Berlin

Herstellung ultra-dünner hoch-[epsilon]r Oxide und deren Verhalten unter dynamischen elektrischen Stressbedingungen

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Berlin: Logos Verlag, [2019]

Published in: NaMLab gGmbH: Research at NaMLab ; 6
Moriam, Sadia [Author] ; Fettweis, Gerhard [Degree supervisor]; Herkersdorf, Andreas [Degree supervisor] Technische Universität Dresden

On fault resilient network-on-chip for many core systems

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Dresden, [2018?]
Jiang, Nan [Author] ; Technische Universität Chemnitz

Power cycling capabilities of advanced power packaging materials

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Chemnitz, [2018?]
Lorenz, Enno [Author] ; Technische Universität Dresden

Zuverlässigkeit von Durchkontaktierungen für flexible elektronische Systeme

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Dresden: TUDpress, 2018

Published in: Dresdner Beiträge zur Aufbau- und Verbindungstechnik der Elektronik ; 4
Loznen, Steli [Author]; Bolintineanu, Constantin [Author]; Swart, Jan [Author]

Electrical product compliance and safety engineering

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Boston; London: Artech House, [2017]

Published in: Electrical product compliance and safety engineering ; 1
Liou, Juin J. [Editor]; Iniewski, Krzysztof [Other]

Electrostatic discharge protection : advances and applications

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Boca Raton, FL; London; New York: CRC Press, Taylor & Francis Group, [2016]

Published in: Devices, circuits and systems
Barke, Martin [Author]

Aging aware robustness validation of digital integrated circuits

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München: Dr. Hut, 2015

Published in: Elektrotechnik
Pfennig, Stephan [Author]

Charakterisierung der Modenverwirbelungskammer der TU Dresden und Untersuchung von Verfahren zur Bestimmung der unabhängigen Rührerstellungen

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2015
Pfennig, Stephan [Author]

Charakterisierung der Modenverwirbelungskammer der TU Dresden und Untersuchung von Verfahren zur Bestimmung der unabhängigen Rührerstellungen

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Dresden: TUDpress, Verl. der Wiss., 2015
Reithe, Annegret [Author]

Charakterisierung verschaltungsbedingter Degradationsmechanismen in flexiblen CIGS-Solarmodulen - [1. Aufl.]

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Aachen: Shaker, 2015

Published in: Schriftenreihe der Reiner-Lemoine-Stiftung
Swingler, Jonathan [Editor]

Reliability characterisation of electrical and electronic systems

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Amsterdam; Boston; Cambridge: Elsevier/WP, Woodhead Publishing, [2015]

Published in: Woodhead Publishing series in electronic and optical materials ; 74
Kupke, Steve [Author] ; Technische Universität Dresden

Reliability of high-k-metal gate field-effect transistors considering circuit operational constraints - [1. Auflage]

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Norderstedt: Books on Demand, 2015

Published in: Research at namlab
Bobrowski, Sebastian [Author] ; Universität Stuttgart

Zuverlässigkeitsuntersuchungen und Lebensdauerprognose am Beispiel feinwerktechnischer Antriebe

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Stuttgart: IKFF, 2015

Published in: Universität Stuttgart: Bericht / IKFF ; 41
Bohlländer, Marco [Author]

Lastwechseltestbasierte Lebensdaueranalysemethoden für Leistungshalbleiter in Offshore-Windenergieanlagen

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Chemnitz: Universitätsverl. Chemnitz, 2014
Gan, Zhenghao [Author]; Wong, Waisum [Author]; Liou, Juin J. [Author]

Semiconductor process reliability in practice

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New York [u.a.]: McGraw-Hill, 2013
Dietrich, Manfred [Editor] ; Informationstechnische Gesellschaft, Informationstechnische Gesellschaft, Gesellschaft für Informatik, Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, Fachtagung Zuverlässigkeit und Entwurf 2013 Dresden

Zuverlässigkeit und Entwurf : 7. ITG/GI/GMM-Fachtagung vom 24. bis 26. September 2013 in Dresden

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Berlin; Offenbach: VDE-Verl., 2013

Published in: Informationstechnische Gesellschaft: ITG-Fachbericht ; 244,buch
Dietrich, Manfred [Editor] ; Informationstechnische Gesellschaft, Informationstechnische Gesellschaft, Gesellschaft für Informatik, Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, Fachtagung Zuverlässigkeit und Entwurf 2013 Dresden

Zuverlässigkeit und Entwurf : 7. ITG/GI/GMM-Fachtagung vom 24. bis 26. September 2013 in Dresden - [Online-Ressource]

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Berlin; Offenbach: VDE-Verl., 2013

Published in: Informationstechnische Gesellschaft: ITG-Fachbericht ; 24400
Tan, Cher Ming [Author]; Gan, Zhenghao [Author]; Li, Wei [Author]; Hou, Yuejin [Author]

Applications of finite element methods for reliability studies on ULSI interconnections

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London; Dordrecht; Heidelberg; New York: Springer, [2011]

Published in: Springer Series in Reliability Engineering

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