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  1. Sherwani, Naveed A. [Author]; Bhingarde, Siddharth [Author]; Panyam, Anand [Author]

    Routing in the third dimension : from VLSI chips to MCMs

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    New York, NY: IEEE Press, 1995

    Published in: IEEE Press series on microelectronic systems

  2. Lau, John H. [Editor]

    Flip chip technologies

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    New York, NY [u.a.]: McGraw-Hill, c 1996

    Published in: Electronic packaging and interconnection series

  3. Chattopadhyay, Kabitri [Author] ; Beyer, Hans-Georg [Degree supervisor]; Feudel, Ulrike [Degree supervisor]

    Optimization of spatial balancing and storage needs for large-scale power system integration of fluctuating solar energy

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    Oldenburg: BIS der Universität Oldenburg, 2017

  4. Scholer, Matthias [Author] ; Müller, Rainer [Degree supervisor]

    Wandlungsfähige und angepasste Automation in der Automobilmontage mittels durchgängigem modularem Engineering -Am Beispiel der Mensch-Roboter-Kooperation in der Unterbodenmontage-

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    Saarbrücken: Saarländische Universitäts- und Landesbibliothek, 2019

  5. Brinkmann, Malte [Author]; Haase, Felix [Author]; Bothe, Karsten [Author]; Bittkau, Karsten [Author]; Lambertz, Andreas [Author]; Duan, Weiyuan [Author]; Ding, Kaining [Author]; Sperlich, Hans-Peter [Author]; Waltinger, Andreas [Author]; Schulte-Huxel, Henning [Author]

    Impact of the contacting scheme on I-V measurements of metallization-free silicon heterojunction solar cells - [published Version]

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    Les Ulis : EDP Sciences, 2023

    Published in: EPJ Photovoltaics 14 (2023) ; EPJ Photovoltaics

  6. Schulte-Huxel, Henning [Author]; Römer, Udo [Author]; Blankemeyer, Susanne [Author]; Merkle, Agnes [Author]; Larionova, Yevgeniya [Author]; Steckenreiter, Verena [Author]; Peibst, Robby [Author]; Kajari-Schröder, Sarah [Author]; Brendel, Rolf [Author]

    Two-level metallization and module integration of point-contacted solar cells - [published Version]

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    Amsterdam : Elsevier, 2014

    Published in: Energy Procedia 55 (2014)

  7. Kiefer, Fabian [Author]; Brendemühl, Till [Author]; Berger, Miriam [Author]; Lohse, Anja [Author]; Kirstein, Sabine [Author]; Braun, Nadja [Author]; Lehr, Martin [Author]; Heinemeyer, Frank [Author]; Jung, Verena [Author]; Morlier, Arnaud [Author]; Blankemeyer, Susanne [Author]; Kunze, Iris [Author]; Winter, Renate [Author]; Harder, Nils-Peter [Author]; Dullweber, Thorsten [Author]; Köntges, Marc [Author]; Brendel, Rolf [Author]

    Influence of solder pads to PERC solar cells for module integration - [published Version]

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    Amsterdam : Elsevier, 2013

    Published in: Energy Procedia 38 (2013)

  8. Ziegler, Thomas [Author]; Jubaer, Hasan [Author]; Halemba, Remigius [Author]; Abele, Helmar [Author]; Rimpel, Eckhard [Author]; Tretau, Anne [Author] ; Prüf- und Forschungsinstitut Pirmasens

    Cornet project HP4DRYING - energetic and environmental optimisation of drying processes by integration of heat pumps : Schlussbericht

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    [Pirmasens]: PFI Germany, [2016?]

  9. Sherwani, N. A. [Other]; Bhingarde, Siddharth [Other]; Panyam, Anand [Other] ; IEEE Xplore (Online service), John Wiley & Sons

    Routing in the third dimension : from VLSI chips to MCMs

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    Piscataway, NJ; New York: IEEE Press, [1995] ; Online-Ausg.

    Published in: IEEE Xplore Digital Library