Media type: Book Title: Flip chip technologies Contributor: Lau, John H. [Hrsg.] imprint: New York, NY [u.a.]: McGraw-Hill, c 1996 Published in: Electronic packaging and interconnection series Extent: XXIV, 565 S; Ill., graph. Darst; 23 cm Language: English ISBN: 0070366098 RVK notation: ZN 4200 : Allgemeines ZN 4130 : Technologie der oberflächenmontierten Bauelemente (Surface mount technology, SMT) ZN 4132 : Montage ungehäuster Halbleiter (COB; Flip-chip; TAB) Keywords: Chip > Herstellung Origination: Footnote:
Departmental Library DrePunct – stack Shelf-mark: 2011 8 056783 Item ID: 32996461 Status: Loanable, place order > Ordering possible ‒ please log in Delivery expected: 1 - 2 days after order