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  1. Harman, George G. [Editor]; Mach, Pavel [Other] ; Advanced Research Workshop on Microelectronic Interconnections and Assembly 1996 Prag

    Microelectronic interconnections and assembly : [proceedings of the NATO Advanced Research Workshop on Microelectronic Interconnections and Assembly, Prague, Czech Republic, 18-21 May, 1996]

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    Dordrecht [u.a.]: Kluwer Acad. Publ., 1998

    Published in: NATO: NATO ASI series / Partnership sub-series / 3 ; 54

  2. Suhir, Ephraim [Editor] ; Materials Research Society, Symposium on the Mechanical Behavior of Materials and Structures in Microelectronics 1991 Anaheim, Calif

    Mechanical behavior of materials and structures in microelectronics : symposium held April 30 - May 3, 1991, Anaheim, California, USA

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    Pittsburg, Pa.: Materials Research Society, 1991

    Published in: Materials Research Society: Materials Research Society symposium proceedings ; 22600

  3. Datta, Madhav [Editor]; Sheppard, Keith [Other]; Dukovic, John O. [Other] ; International Symposium on Electrochemical Microfabrication 2 1994 Miami Beach, Fla, Electrochemical Society Electrodeposition Division

    Proceedings of the Second International Symposium on Electrochemical Microfabrication : [... held October 10 - 12, 1994 in Maimi Beach, Florida ...]

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    Pennington, NJ: Electrochemical Society, 1995

    Published in: Electrochemical Society: Proceedings volume ; 94,32

  4. Bi, Keyun [Other] ; Zhongguo dian zi xue hui, Components, Packaging, and Manufacturing Technology Society, Electronic Manufacturing and Packaging Technology Society, Guilin-Dianzi-Keji-Daxue

    13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2012) : 13 - 16 Aug. 2012, Location: Guilin Bravo Hotel, Guilin, China

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    Piscataway, NJ: IEEE, 2012

  5. Bi, Keyun [Other] ; Zhongguo dian zi xue hui, Components, Packaging, and Manufacturing Technology Society, Electronic Manufacturing and Packaging Technology Society, Shang hai da xue

    12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 : 8 - 11 Aug. 2011, Shanghai, China ; proceedings

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    Piscataway, NJ: IEEE, 2011

  6. Bi, Keyun [Other] ; Zhongguo dian zi xue hui, Electronic Manufacturing and Packaging Technology Society, Components, Packaging, and Manufacturing Technology Society

    11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 : 16 - 19 Aug. 2010, Xi'an, China ; proceedings

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    Piscataway, NJ: IEEE, 2010

  7. Bi, Keyun [Other] ; Zhongguo dian zi xue hui, China Electronic Packaging Society, Qing hua da xue Peking, Components, Packaging, and Manufacturing Technology Society

    International Conference on Electronic Packaging Technology & High Density Packaging, 2009 : ICEPT-HDP '09 ; 10 - 13 Aug. 2009, Beijing, China ; proceedings

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    Piscataway, NJ: IEEE, 2009

  8. International Symposium on Advanced Packaging Materials (1999 :Braselton, Ga.), American Society for Metals, Components, Packaging & Manufacturing Technology Society, Georgia Institute of Technology Packaging Research Center, International Microelectronics and Packaging Society, IEEE Components, Hybrids, and Manufacturing Technology Society

    Proceedings, International Symposium on Advanced Packaging Materials : Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia, March 14-17, 1999

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    [Piscataway, N.J.]: IEEE, 2000

  9. Components, Packaging, and Manufacturing Technology Society Taipei Chapter

    2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014) : 22 - 24 Oct. 2014, Taipei, Taiwan ; held in conjunction with the 16th EMAP (International Conference on Electronics Materials and Packaging)

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    Piscataway, NJ: IEEE, 2014

  10. Components, Packaging, and Manufacturing Technology Society Taipei Chapter

    8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 : 22 - 25 Oct. 2013, Taipei ; [held with] the 2nd IAAC (IMAPS All Asia Conference)

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    Piscataway, NJ: IEEE, 2013

  11. Institute of Electrical and Electronics Engineers, Components, Packaging, and Manufacturing Technology Society

    7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 : 24 - 26 Oct. 2012, Taipei

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    Piscataway, NJ: IEEE, 2012

  12. Institute of Electrical and Electronics Engineers, Components, Packaging, and Manufacturing Technology Society Taipei Chapter, Industrial Technology Research Institute Hsinchu

    2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, (IMPACT 2010) : 20 - 22 Oct. 2010, Taipei Nangang Exhibition Center

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    Piscataway, NJ: IEEE Service Center, 2010

  13. Components, Packaging, and Manufacturing Technology Society Taipei Chapter, Industrial Technology Research Institute Hsinchu

    4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009 : IMPACT 2009 ; 21 - 23 Oct. 2009, Taipei, Taiwan ; [held together with] International 3D IC Conference

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    Piscataway, NJ: IEEE, 2009

  14. Institute of Electrical and Electronics Engineers

    3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008 : IMPACT 2008 ; date: 22 - 24 Oct. 2008, Taipei ; [held in conjunction with] International Conference on Electronic Materials and Packaging (EMAP 2008)

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    Piscataway, NJ: IEEE, 2008