Media type: E-Book; Conference Proceedings Title: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 : 12 - 14 December 2011, Hanzhou, China Corporation: Institute of Electrical and Electronics Engineers imprint: Piscataway, NJ: IEEE, 2011 Extent: Online-Ressource Language: English ISBN: 9781467322881; 1467322881; 146732289X; 9781467322898 Keywords: Microelectronic packaging Congresses ; Electronic packaging Congresses ; Konferenzschrift Origination: Footnote: Parallel als Druckausg. erschienen