Media type: E-Book; Conference Proceedings Title: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2010 : 7 - 9 Dec. 2010, Singapore, Singapore Corporation: Institute of Electrical and Electronics Engineers imprint: Piscataway, NJ: IEEE, 2010 Extent: Online-Ressource Language: English ISBN: 9781424490684; 1424490685 Keywords: Microelectronic packaging Congresses ; Electronic packaging Congresses ; Konferenzschrift Origination: Footnote: Parallel als Druckausg. erschienen