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  1. Van der Plas, Geert; Limaye, Paresh; Loi, Igor; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Katti, Guruprasad; Velenis, Dimitrios; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupac, Miro; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; [...]

    Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

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    Institute of Electrical and Electronics Engineers (IEEE), 2011

    Published in: IEEE Journal of Solid-State Circuits