> Publishers' series
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222:
Application of fracture mechanics in electronic packaging [contains 23 technical papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging] ; presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas sponsored by the Applied Mechanics Division, ASME... Ed. by William T. Chen
New York, NY: Soc., 1973-
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190:
Developments in electrorheological flows and measurement uncertainty 1994 presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 spons. by The Fluids Engineering Division and The Applied Mechanics Division, ASME. Ed. by D. A. Siginer
New York, NY: Soc., 1973-
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123:
Smart structures and materials presented at ... Atlanta, Georgia, December 1 - 6, 1991 ed. George K. Haritos
New York, NY: Soc., 1973-
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32:
Serial number list of compound names and references to published infrared spectra
New York, NY: Soc., 1973-