Media type: E-Book; Thesis Title: Montage und Biegeverhalten von SMD-Bauelementen und ultradünnen Chips auf Foliensubstraten Parallel title: Assembly and bending behavior characterization of SMD components and ultra-thin chips on foil substrates Contributor: Saleh, Rafat [Author]; Zimmermann, André [Degree supervisor] Published: Stuttgart, 2024 Extent: 1 Online-Ressource (145 Seiten); Illustrationen, Diagramme Language: German DOI: 10.18419/opus-14239 Identifier: Keywords: Hochschulschrift Origination: University thesis: Dissertation, Universität Stuttgart, 2023 Footnote: Access State: Open Access