Media type: Book Title: Silicon wafer bonding technology : for VLSI and MEMS applications Contributor: Iyer, Subramanian S. [Hrsg.]; Auberton-Hervé, Andre J. [Other] Corporation: Institution of Electrical Engineers imprint: London: Institution of Electrical Engineers, 2002 Published in: Electronic Materials Information Service: EMIS processing series ; 1 Extent: XXV, 149 S; Ill., graph. Darst; 26 cm Language: English ISBN: 0852960395 RVK notation: ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging Keywords: Silicium > Wafer > Bonden > VLSI > Mikromechanik SOI-Technik Origination: Footnote: Includes bibliographical references and index
Departmental Library DrePunct – open access area Shelf-mark: ZN 4192 I97 Item ID: 30920862 Status: Loanable