Media type: E-Book; Conference Proceedings Title: Electrical Design of Advanced Packaging and Systems Symposium, 2008 : EDAPS 2008 ; 10 - 12 Dez. 2008. Seoul, Korea Other titles: Nebent.: Proceedings // 2008 Electrical Design of Advanced Packaging and Systems Symposium (IEEE EDAPS 2008) Corporation: Institute of Electrical and Electronics Engineers ; Components, Packaging, and Manufacturing Technology Society imprint: Piscataway, NJ: IEEE, 2008 Extent: Online-Ressource (225 S.) Language: English ISBN: 1424426332; 9781424426331 Keywords: Integrated passive components Congresses ; Electronic packaging Congresses ; Electromagnetic interference Congresses ; Signal integrity (Electronics) Congresses ; Konferenzschrift Origination: Footnote: Parallel als Druckausg. erschienen