Media type: Book; Thesis Title: Interconnect planning for physical design of 3D integrated circuits Other titles: Nebent.: Interconnect planning for 3D-IC design Contributor: Knechtel, Johann [Author] imprint: Düsseldorf: VDI-Verl., 2014 Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 45500 Issue: Als Ms. gedr. Extent: IX, 138 S.; Ill., graph. Darst Language: English ISBN: 9783183455201 RVK notation: ZN 4904 : Schaltungsentwurf Keywords: Dreidimensionale Integration > Layout > Block-Layout > Durchkontaktieren > Silicium > Verbindungstechnik Origination: University thesis: Zugl.: Dresden, Techn. Univ., Fak. Elektrotechnik und Informationstechnik, Diss., 2014 Footnote: Kurzfassung in dt. Sprache Mit Kurzfassung in dt. Sprache
Departmental Library DrePunct – open access area Shelf-mark: ZN 4904 K68 Item ID: 34116695 Status: Loanable
Central Library – stack Shelf-mark: 2014 8 030567 Item ID: 34116693 Status: Loanable, place order > Ordering possible ‒ please log in
Departmental Library DrePunct – stack Shelf-mark: 2014 8 030569 Item ID: 34116694 Status: Place order for use in library, no dispatch by interlibrary loan; delivery of photocopies possible > Ordering possible ‒ please log in