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Knechtel, Johann [Author]

Interconnect planning for physical design of 3D integrated circuits - [Als Ms. gedr.]

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  • Media type: Book; Thesis
  • Title: Interconnect planning for physical design of 3D integrated circuits
  • Other titles: Nebent.: Interconnect planning for 3D-IC design
  • Contributor: Knechtel, Johann [Author]
  • Published: Düsseldorf: VDI-Verl., 2014
  • Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 45500
  • Issue: Als Ms. gedr.
  • Extent: IX, 138 S.; Ill., graph. Darst
  • Language: English
  • ISBN: 9783183455201
  • RVK notation: ZN 4904 : Schaltungsentwurf
  • Keywords: Dreidimensionale Integration > Layout > Block-Layout > Durchkontaktieren > Silicium > Verbindungstechnik
  • Origination:
  • University thesis: Zugl.: Dresden, Techn. Univ., Fak. Elektrotechnik und Informationstechnik, Diss., 2014
  • Footnote: Kurzfassung in dt. Sprache
    Mit Kurzfassung in dt. Sprache

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Departmental Library DrePunct – open access area

  • Status: Loanable

Central Library – stack

  • Shelf-mark: 2014 8 030567
  • Item ID: 34116693
  • Status: Loanable, place order
Orders received from Mon - Fri by 1 pm are expected to be ready for you on the same day.

Departmental Library DrePunct – stack

  • Shelf-mark: 2014 8 030569
  • Item ID: 34116694
  • Status: Place order for use in library, no dispatch by interlibrary loan; delivery of photocopies possible
Delivery expected: 1 - 2 days after order