Media type: E-Article Title: Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices Contributor: Yang, Bao; Wang, Peng; Bar-Cohen, Avram imprint: Institute of Electrical and Electronics Engineers (IEEE), 2007 Published in: IEEE Transactions on Components and Packaging Technologies Language: Not determined DOI: 10.1109/tcapt.2007.898744 ISSN: 1521-3331 Origination: Footnote: