Media type: E-Article Title: Failure mechanisms of aluminum bondpad peeling during thermosonic bonding Contributor: Cher Ming Tan; Zhenghao Gan imprint: Institute of Electrical and Electronics Engineers (IEEE), 2003 Published in: IEEE Transactions on Device and Materials Reliability Language: English DOI: 10.1109/tdmr.2003.814408 ISSN: 1530-4388 Keywords: Electrical and Electronic Engineering ; Safety, Risk, Reliability and Quality ; Electronic, Optical and Magnetic Materials Origination: Footnote: