Temperature and stress distribution in the SOI structure during fabrication

Medientyp: E-Artikel
Titel: Temperature and stress distribution in the SOI structure during fabrication
Beteiligte: Cher Ming Tan; Zhenghao Gan; Xiaofang Gao
Erschienen: Institute of Electrical and Electronics Engineers (IEEE), 2003
Erschienen in: IEEE Transactions on Semiconductor Manufacturing
Sprache: Englisch
DOI: 10.1109/tsm.2003.811886
ISSN: 0894-6507
Schlagwörter: Electrical and Electronic Engineering ; Industrial and Manufacturing Engineering ; Condensed Matter Physics ; Electronic, Optical and Magnetic Materials
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