An Advanced Finite Element Model for BiCMOS Process Oriented Ultra-Thin Wafer Deformation

Medientyp: E-Artikel
Titel: An Advanced Finite Element Model for BiCMOS Process Oriented Ultra-Thin Wafer Deformation
Beteiligte: Cao, Zhibo; Goritz, Alexander; Stocchi, Matteo; Wietstruck, Matthias; Hoyer, Christian; Steinweg, Luca David; Carta, Corrado; Ellinger, Frank; Tillack, Bernd; Kaynak, Mehmet
Erschienen: Institute of Electrical and Electronics Engineers (IEEE), 2022
Erschienen in: IEEE Transactions on Semiconductor Manufacturing
Sprache: Nicht zu entscheiden
DOI: 10.1109/tsm.2021.3132550
ISSN: 0894-6507; 1558-2345
Schlagwörter: Electrical and Electronic Engineering ; Industrial and Manufacturing Engineering ; Condensed Matter Physics ; Electronic, Optical and Magnetic Materials
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