Skip to contents

Frömmig, Max [Author]

Nutzung des Kapillareffektes zur Überwindung von Chipverwölbungen während der Montage dünner Siliziumchips

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Templin: Detert, 2015

Published in: System integration in electronic packaging ; 24
Franke, Jörg [Editor]

Räumliche elektronische Baugruppen (3D-MID) : Werkstoffe, Herstellung, Montage und Anwendungen für spritzgegossene Schaltungsträger

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

München: Hanser, [2013]
Arning, Volker [Author]

Industrial scale surface self assembly

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

2010
Ziroff, Andreas [Author]

SMT-kompatible Millimeterwellenmodule in LTCC-Mehrlagenkeramiktechnologie

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

2007
Suganuma, Katsuaki [Editor]

Lead-free soldering in electronics : science, technology and environmental impact

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

New York [u.a.]: Dekker, 2004
Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID

Technologie 3D-MID : räumliche elektronische Baugruppen ; Herstellungsverfahren, Gebrauchsanforderungen, Materialkennwerte

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

München: Hanser, 2004
Leider, Wolfgang [Author]

Dampfphasenlöten : Grundlagen und praktische Anwendung ; mit 17 Tabellen - [1. Aufl.]

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Bad Saulgau: Leuze, 2002
Reichenberger, Marcus [Author]

Eigenschaften und Einsatzmöglichkeiten alternativer Elektroniklote in der Oberflächenmontage (SMT)

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Bamberg: Meisenbach, 2001

Published in: Fertigungstechnik - Erlangen ; 11300
Blackwell, Glenn R. [Editor]

The electronic packaging handbook

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Boca Raton, Fla. [u.a.]: CRC Press [u.a.], 2000

Published in: Electronics handbook series
Lau, John H. [Author]

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

New York, NY [u.a.]: McGraw-Hill, 2000

Published in: Professional engineering
Lau, John H. [Author]; Lee, Shi-Wei Ricky [Author]

Chip scale package (CSP) : design, materials, processes, reliability, and applications

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

New York, NY [u.a.]: McGraw-Hill, 1999

Published in: Electronic packaging and interconnection series
Gurnett, Keith W. [Author]

Surface mount handbook

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Sutton: Reed Electronics Research, c1999
Keil, Mathias [Author]

Beiträge zur Beschreibung des Qualitätsverhaltens in der Oberflächenmontage

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

1998
Luchs, Ralf [Author]

Einsatzmöglichkeiten leitender Klebstoffe zur zuverlässigen Kontaktierung elektronischer Bauelemente in der SMT

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Bamberg: Meisenbach, 1998

Published in: Fertigungstechnik - Erlangen ; 8500
Härtl, Alfred [Author]

SMD, Surface Mounted Device : Einführung, Kennzeichnungsmerkmale, Verarbeitungsmethoden, Tabellenübersicht, Schaltungsvorschläge, Vergleichstypen, Anschlußbelegungen, Code-Aufschlüsselung

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Hirschau: Härtl, 1998
Strauss, Rudolf [Author]

SMT soldering handbook - [2nd ed]

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Oxford [u.a.]: Newnes, 1998
Prasad, Ray P. [Author]

Surface mount technology : principles and practice - [2. ed.]

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

New York [u.a.]: Chapman & Hall [u.a.], 1997
Bossemeyer, Armin [Author]; Bossemeyer, Armin Horst [Author] ; Fröhner, Klaus-Dieter [Other]; Rall, Klaus [Other] Technische Universität Hamburg-Harburg Arbeitsbereich Arbeitswissenschaft

Fehlervermeidung in der SMD-Montage durch personenbezogene Gestaltung - [Als Ms. gedr.]

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Düsseldorf: VDI-Verl., 1996

Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI ; 40600
Lau, John H. [Editor]

Flip chip technologies

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

New York, NY [u.a.]: McGraw-Hill, c 1996

Published in: Electronic packaging and interconnection series
Keller, Gustl [Author]

Oberflächenmontagetechnik : eine praxisnahe Einführung in die SMT ; mit 14 Tabellen - [1. Aufl.]

Close

Bookmarks

You can manage bookmarks using lists, please log in to your user account for this.

Saulgau/Württ.: Leuze, 1995

You did not find what you were looking for?

Purchase suggestion
Are you missing something you need for your research? If you have any suggestions please share them here.

Interlibrary Loan
Please search and order your favorite title in the Interlibrary Loan Portal.

Search in field:

Recently searched for:

You did not find what you were looking for?

> Year of publication

Year of publication