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Kern, Werner [Editor]

Handbook of semiconductor wafer cleaning technology : science, technology, and applications

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Park Ridge, NJ: Noyes Publ., 1993

Published in: Materials science and process technology series ; Electronic materials and process technology
Tong, Quin-Yi [Author]; Tong, Qin-Yi [Author]; Gösele, Ulrich [Author] ; Electrochemical Society

Semiconductor wafer bonding : science and technology

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New York; Weinheim [u.a.]: Wiley, 1999

Published in: The Electrochemical Society series
Reinhardt, Karen A. [Editor]; Kern, Werner [Editor]

Handbook of silicon wafer cleaning technology - [Third edition]

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Oxford; Cambridge: William Andrew, [2018]
Campen, Edgar van [Author]

Design of a multi-process multi-product wafer fab

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2001
Wiemer, Maik [Author]; Herziger, Kai [Author]; Geßner, Thomas [Author]

Silizium-Waferbonden: Montageprozesse für Silizium- und Glasmaterialien in der Mikromechanik

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Düsseldorf: Verl. für Schweißen und Verwandte Verfahren, DVS-Verl., 1998

Published in: Deutscher Verband für Schweißen und Verwandte Verfahren: DVS-Berichte ; 19300
Ramm, Peter [Editor]; Lu, James Jian-Qiang [Other]; Taklo, Maaike M. V. [Other]

Handbook of wafer bonding

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Weinheim: Wiley-VCH-Verl., 2012
Alexe, Marin [Editor]; Gösele, Ulrich [Other]

Wafer bonding : applications and technology ; with 372 figures and 25 tables

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Berlin; Heidelberg [u.a.]: Springer, 2004

Published in: Springer series in materials science ; 75
Hunt, C. E. [Other] ; Electrochemical Society Electronics Division, International Symposium on Semiconductor Wafer Bonding: Physics and Applications 3 1995 Reno, Nev

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications : [held at Reno in spring 1995]

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Pennington, NJ: Electrochemical Society, 1995

Published in: Electrochemical Society: Proceedings volume ; 95,7
Tan, Chuan Seng [Editor]; Gutmann, Ronald J. [Editor]; Reif, L. Rafael [Editor]

Wafer level 3-D ICs process technology

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New York, NY: Springer, 2008

Published in: Series on integrated circuits and systems
Möller, Hans-Joachim [Editor] ; Freiberger Forschungsforum 2 2000 Freiberg, Berg- und Hüttenmännischer Tag 51 2000 Freiberg

Kristallisation und Technik : Halbleitermaterialien, Prozesstechnologie und Diagnostik ; Vorträge zum 51. Berg- und Hüttenmännischen Tag 2000 - [1. Aufl]

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Freiberg: TU Bergakad., 2002

Published in: Freiberger Forschungshefte / B ; 321
Menz, Carsten [Author]

Randzonenanalyse bearbeiteter Silizium-Oberflächen - [Als Ms. gedr.]

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Düsseldorf: VDI-Verl., 1997

Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI ; 43100
Mack, Stefan [Author]

Eine vergleichende Untersuchung der physikalisch-chemischen Prozesse an der Grenzschicht direkt und anodisch verbundener Festkörper

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Düsseldorf: VDI-Verl., 1997

Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI ; 43600
Wietstruck, Matthias [Author] ; Universitätsbibliothek Chemnitz

Through-silicon vias in SiGe BiCMOS and interposer technologies for sub-THz applications

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Chemnitz: Universitätsverlag Chemnitz, 2023
López Alonso, Elena [Author]

Plasmachemisches Trockenätzen von Solarwafern mit Atmosphärendruck-Plasmen - [1. Aufl.]

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Aachen: Shaker, 2014

Published in: Berichte aus der Fertigungstechnik
Schmidt, Christian [Author]

Verkapselungstechnologie mit justiertem adhäsiven Waferbonden für OLED-auf-CMOS-Anwendungen

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Dresden: TUDpress, 2012
Ohmori, Hitoshi [Editor]

Electrolytic in-process dressing (ELID) technologies : fundamentals and applications

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Boca Raton, Fla. [u.a.]: CRC Press, c 2011
Liedke, Thomas [Author]

Makro- und mikromechanische Untersuchungen zum Drahtsägen von Siliziumwafern

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Freiberg: Techn. Univ. Bergakad., 2011

Published in: Institut für Mechanik und Fluiddynamik: Berichte des Instituts für Mechanik und Fluiddynamik ; 7
Schönfelder, Stephan [Author]

Experimentelle und theoretische Untersuchungen zur Festigkeit dünner Siliziumsubstrate

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Halle (Saale): Fraunhofer-Institutfür Werkstoffmechanik IWM, 2010

Published in: Fraunhofer-Institut für Werkstoffmechanik IWM: Fraunhofer-Institut Werkstoffmechanik / W ; 2010,5
Reinicke, Marco [Author]

Investigation of physical and chemical interactions during etching of silicon in dual frequency capacitively coupled HBr/NF3 gas discharges

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Norderstedt: Books on Demand GmbH, 2009
Pähler, Dietmar [Author]

Rotational grinding of silicon wafers - [1. ed.]

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Aachen: Apprimus-Verl., 2010

Published in: Ergebnisse aus der Produktionstechnik ; 2010,11

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