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Garrou, Philip E. [Editor]; Bower, Christopher [Other]; Ramm, Peter [Other]; Koyanagi, Mitsumasa [Other]

Handbook of 3D integration : technology and applications of 3D integrated circuits

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Weinheim: Wiley-VCH, 20XX-
Partsch, Uwe [Author]

LTCC-kompatible Sensorschichten und deren Applikation in LTCC-Drucksensoren - [1. Aufl.]

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Templin: Detert, 2002

Published in: Themenreihe: Elektronik-Technologie in Forschung und Praxis ; 9
Deng, Yangdong [Author]; Maly, Wojciech P. [Author]

3-dimensional VLSI : a 2.5-dimensional integration scheme

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4030 Beijing: Tsinghua Univ. Press, 2010 ; Berlin; Heidelberg: Springer, 2010
Papanikolaou, Antonis [Editor]

Three dimensional system integration : IC stacking process and design

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New York; Heidelberg [u.a.]: Springer, 2011
Knechtel, Johann [Author]

Interconnect planning for physical design of 3D integrated circuits - [Als Ms. gedr.]

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Düsseldorf: VDI-Verl., 2014

Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 45500
Gerlach, Gerald [Editor]; Wolter, Klaus-Jürgen [Other]

Bio and nano packaging techniques for electron devices : advances in electronic device packaging

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Berlin; Heidelberg: Springer, 2012
Brunschwiler, Thomas [Author]

Interlayer thermal management of high-performance microprocessor chip stacks - [1. Aufl.]

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Göttingen: Cuvillier, 2012
Rebenklau, Lars [Author]

Beiträge zum Aufbau und zur Technologie LTCC-basierter mikrofluidischer Bauelemente und Systeme - [1. Aufl.]

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Templin: Detert, 2003

Published in: Themenreihe: Elektronik-Technologie in Forschung und Praxis ; 11
Wiest, Florian [Author]

Mikrosystemtechnische Realisierung von Induktivitäten

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Aachen: Shaker, 2001

Published in: Berichte aus der Elektrotechnik
Roos, Gerhard [Author]

Zur drei-dimensionalen Integration von CMOS-Schaltungen - [Als Ms. gedr]

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Düsseldorf: VDI-Verlag, 1993

Published in: Verein Deutscher Ingenieure: Fortschrittberichte VDI / 9 ; 168
Hilleringmann, Ulrich [Author]

Laserrekristallisation von Silizium: Integration von CMOS-Schaltungen auf isolierendem Substrat

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Düsseldorf: VDI-Verl., 1988

Published in: Verein Deutscher Ingenieure: Fortschrittberichte VDI / 9 ; 82
Panchenko, Iuliana [Author]

Process-dependent microstructure changes in solid-liquid interdiffusion interconnects for 3D integration / Iuliana Panchenko$h - [1. Aufl.]

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Templin: Detert, 2014

Published in: System integration in electronic packaging ; 20
Dietrich, Manfred [Editor] ; Informationstechnische Gesellschaft, Informationstechnische Gesellschaft, Gesellschaft für Informatik, Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, Fachtagung Zuverlässigkeit und Entwurf 2013 Dresden

Zuverlässigkeit und Entwurf : 7. ITG/GI/GMM-Fachtagung vom 24. bis 26. September 2013 in Dresden - [Online-Ressource]

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Berlin; Offenbach: VDE-Verl., 2013

Published in: Informationstechnische Gesellschaft: ITG-Fachbericht ; 24400
Fischbach, Robert [Author]

Layoutrepräsentationen für den Entwurf dreidimensionaler elektronischer Systeme - [Als Ms. gedr.]

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Düsseldorf: VDI-Verl., 2012

Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 44000
Al-Rabadi, Anas N. [Author]

Reversible logic synthesis : from fundamentals to quantum computing

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Berlin; Heidelberg [u.a.]: Springer, 2004

Published in: Engineering: online library
Schwerz, Robert [Author] ; Technische Universität Dresden

Zuverlässigkeitsanalyse von gekapselten Bauelementen in der 3D-Leiterplattenintegration

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Dresden: TUDpress, 2018

Published in: Dresdner Beiträge zur Aufbau- und Verbindungstechnik der Elektronik ; 5
Zschenderlein, Uwe [Author]

Zerstörungsfreie Eigenspannungsbestimmung für die Zuverlässigkeitsbewertung 3D-integrierter Kontaktstrukturen in Silizium

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Chemnitz: Universitätsverlag Chemnitz, 2014
Lienig, Jens [Editor]; Dietrich, Manfred [Editor]

Entwurf integrierter 3D-Systeme der Elektronik

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Berlin; Heidelberg: Springer Vieweg, [2012]
Pavlidis, Vasilis F. [Author]; Friedman, Eby G. [Author]

Three-dimensional integrated circuit design

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Amsterdam; Heidelberg [u.a.]: Elsevier Morgan Kaufmann, 2009

Published in: The Morgan Kaufmann series in systems on silicon
Reichl, Herbert [Other] ; Mesago Messe Frankfurt, SMT Hybrid Packaging 2006 Nürnberg

Systemintegration in der Mikroelektronik : Technologien für die 3. Dimension (Heterointegration) in der Leiterplattenfertigung ; SMT Hybrid Packaging, Messe & Kongress, Nürnberg 30. Mai - 1. Juni 2006 ; [Tagungsband]

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Berlin; Offenbach: VDE-Verl., 2006

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