Skip to contents Lykova, Maria [Author] ; Technische Universität Dresden Investigation of Cu-Cu bonding for 2.5D and 3D system integration using self-assembled monolayer as oxidation inhibitor - [1. Auflage] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dresden, 2022 Bakir, Muhannad S. [Editor]; Sitaraman, Suresh K. [Editor] Flexible chip I/O interconnects Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,3 Zhu, Pengli [Editor]; Li, Gang [Editor]; Wong, C. P. [Editor] Flip-chip and underfill materials and technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,1 Palavesam, Nagarajan [Author] ; Technische Universität Dresden Reliability analysis of foil substrate based integration of silicon chips Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dresden, 26.10.2020 Chen, Kuan-Neng [Editor]; Tan, Chuan Seng [Editor] Wafer bonding technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,4 Jung, Dae Young [Editor] Wire bonding technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,2 Lau, John H. [Author] Fan-out wafer-level packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore: Springer, [2018] Li, Yan [Editor]; Deepak, Goyal [Editor]; Goyal, Deepak [Editor] 3D microelectronic packaging : from fundamentals to applications Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Cham: Springer International Publishing AG, [2017] Published in: Advanced microelectronics ; 57 Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis - [Third edition] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton; London; New York: CRC Press, Taylor & Francis Group, [2016] Published in: Engineering - electrical Bülow, Tim [Author] Barriereschichten zur Dünnschichtverkapselung von organischer Elektronik Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. 2014 Poller, Tilo [Author] Thermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Chemnitz: Universitätsverlag Chemnitz, 2014 Lang, Klaus-Dieter [Editor]; Lang, Klaus Dieter [Editor] ; Mesago Messe Frankfurt, SMT Hybrid Packaging 2012 Nürnberg Baugruppentechnologie für die Elektromobilität : SMT Hybrid Packaging, Internationale Fachmesse und Kongress für Systemintegration in der Mikroelektronik, Nürnberg 8. - 10.05.2012 : [Tagungsband] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Berlin; Offenbach: VDI-Verl., 2012 Gerlach, Gerald [Editor]; Wolter, Klaus-Jürgen [Other] Bio and nano packaging techniques for electron devices : advances in electronic device packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Berlin; Heidelberg: Springer, 2012 Greenhouse, Hal [Author]; Lowry, Robert [Author]; Romenesko, Bruce [Author] Hermeticity of electronic packages - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Amsterdam; Heidelberg [u.a.]: Elvesier, 2012 Fischbach, Robert [Author] Layoutrepräsentationen für den Entwurf dreidimensionaler elektronischer Systeme - [Als Ms. gedr.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Düsseldorf: VDI-Verl., 2012 Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 44000 Wojnowski, Maciej [Author] Package characterization techniques for high-frequency applications Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. 2012 Meister, Tilo [Author] Pinzuordnungs-Algorithmen zur Optimierung der Verdrahtbarkeit beim hierarchischen Layoutentwurf - [Als Ms. gedr.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Düsseldorf: VDI-Verl., 2012 Published in: Verein Deutscher Ingenieure: Fortschrittberichte VDI / 9 ; 391 Liu, Yong [Author] Power electronic packaging : design, assembly process, reliability and modeling Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York; Heidelberg [u.a.]: Springer, 2012 Published in: Electrical engineering Schmidt, Christian [Author] Verkapselungstechnologie mit justiertem adhäsiven Waferbonden für OLED-auf-CMOS-Anwendungen Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dresden: TUDpress, 2012 Tan, Cher Ming [Author]; Gan, Zhenghao [Author]; Li, Wei [Author]; Hou, Yuejin [Author] Applications of finite element methods for reliability studies on ULSI interconnections Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. London; Dordrecht; Heidelberg; New York: Springer, [2011] Published in: Springer Series in Reliability Engineering
Lykova, Maria [Author] ; Technische Universität Dresden Investigation of Cu-Cu bonding for 2.5D and 3D system integration using self-assembled monolayer as oxidation inhibitor - [1. Auflage] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dresden, 2022
Bakir, Muhannad S. [Editor]; Sitaraman, Suresh K. [Editor] Flexible chip I/O interconnects Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,3
Zhu, Pengli [Editor]; Li, Gang [Editor]; Wong, C. P. [Editor] Flip-chip and underfill materials and technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,1
Palavesam, Nagarajan [Author] ; Technische Universität Dresden Reliability analysis of foil substrate based integration of silicon chips Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dresden, 26.10.2020
Chen, Kuan-Neng [Editor]; Tan, Chuan Seng [Editor] Wafer bonding technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,4
Jung, Dae Young [Editor] Wire bonding technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,2
Lau, John H. [Author] Fan-out wafer-level packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Singapore: Springer, [2018]
Li, Yan [Editor]; Deepak, Goyal [Editor]; Goyal, Deepak [Editor] 3D microelectronic packaging : from fundamentals to applications Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Cham: Springer International Publishing AG, [2017] Published in: Advanced microelectronics ; 57
Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis - [Third edition] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton; London; New York: CRC Press, Taylor & Francis Group, [2016] Published in: Engineering - electrical
Bülow, Tim [Author] Barriereschichten zur Dünnschichtverkapselung von organischer Elektronik Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. 2014
Poller, Tilo [Author] Thermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Chemnitz: Universitätsverlag Chemnitz, 2014
Lang, Klaus-Dieter [Editor]; Lang, Klaus Dieter [Editor] ; Mesago Messe Frankfurt, SMT Hybrid Packaging 2012 Nürnberg Baugruppentechnologie für die Elektromobilität : SMT Hybrid Packaging, Internationale Fachmesse und Kongress für Systemintegration in der Mikroelektronik, Nürnberg 8. - 10.05.2012 : [Tagungsband] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Berlin; Offenbach: VDI-Verl., 2012
Gerlach, Gerald [Editor]; Wolter, Klaus-Jürgen [Other] Bio and nano packaging techniques for electron devices : advances in electronic device packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Berlin; Heidelberg: Springer, 2012
Greenhouse, Hal [Author]; Lowry, Robert [Author]; Romenesko, Bruce [Author] Hermeticity of electronic packages - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Amsterdam; Heidelberg [u.a.]: Elvesier, 2012
Fischbach, Robert [Author] Layoutrepräsentationen für den Entwurf dreidimensionaler elektronischer Systeme - [Als Ms. gedr.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Düsseldorf: VDI-Verl., 2012 Published in: Verein Deutscher Ingenieure: Fortschritt-Berichte VDI / 20 ; 44000
Wojnowski, Maciej [Author] Package characterization techniques for high-frequency applications Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. 2012
Meister, Tilo [Author] Pinzuordnungs-Algorithmen zur Optimierung der Verdrahtbarkeit beim hierarchischen Layoutentwurf - [Als Ms. gedr.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Düsseldorf: VDI-Verl., 2012 Published in: Verein Deutscher Ingenieure: Fortschrittberichte VDI / 9 ; 391
Liu, Yong [Author] Power electronic packaging : design, assembly process, reliability and modeling Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York; Heidelberg [u.a.]: Springer, 2012 Published in: Electrical engineering
Schmidt, Christian [Author] Verkapselungstechnologie mit justiertem adhäsiven Waferbonden für OLED-auf-CMOS-Anwendungen Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dresden: TUDpress, 2012
Tan, Cher Ming [Author]; Gan, Zhenghao [Author]; Li, Wei [Author]; Hou, Yuejin [Author] Applications of finite element methods for reliability studies on ULSI interconnections Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. London; Dordrecht; Heidelberg; New York: Springer, [2011] Published in: Springer Series in Reliability Engineering
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